Important DatesMarch 25, 2019
Submission Deadline (Full Paper)March 30, 2019
Submission Deadline (Abstract)April 15, 2019
Notification DateApril 30, 2019
Registration DeadlineJuly 15, 2019
Camera-ready DueJuly 20, 2019
Registration Deadline (Listener)
Conference Date & Venue
November 25, 2018! ICDMM2019 will be held in Salamanca, Spain during August 9-12, 2019.
August 15, 2018! Congratulations! Masanobu Kubota (Kyushu University, Japan), Kyunghun Lee (Korea Maritime and Ocean University, South Korea) and Hiroki Kurita (Tohoku University, Japan) won the best presentation awards.
Successfully held in Kuala Lumpur (Malaysia), Beijing (China), and Okinawa (Japan) in the past three years, ICDMM is an annual conference which explores the development and implications in the related fields of Design, Materials and Manufacturing with an objective to present the novel and fundamental advancements. It also serves to foster communication among researchers and practitioners working in a wide variety of scientific areas with a common interest in improving Design, Materials and Manufacturing related techniques.
2019 4th International Conference on Design, Materials and Manufacturing (ICDMM 2019) will be held in Salamanca, Spain during August 9-12, 2019. It is sponsored by International Association of Computer Science and Information Technology and technically assisted by University of Salamanca, University of the Ryukyus, etc. Featured with invited speeches, oral presentations, poster presentations, academic visit and social networking event, ICDMM 2019 welcomes submission of researches concerning any branch of Design, Materials and Manufacturing and the participation of anyone who are interested in these fields.
Salamanca is a magical destination that boasts top-rate
history, culture, food and attractions. Its Old City was
declared a UNESCO World Heritage Site in 1988.
University of Salamanca makes it well known
worldwide—the first university in Spain and the fourth
oldest university in the world. This one factor would
contribute to the city’s growth and prominence as a
major cultural center and renaissance city in Europe up
until the 17th century.
Congratulation that 3 best presenters from ICDMM 2018 are awarded with 50% discount of registration fee at ICDMM 2019.
1. Masanobu Kubota, Kyushu University, Japan
Paper Title: Effects of Hydrogen and Weld Defect on Tensile Properties of SUH660 and SUS316L Welded Joints
2. Kyunghun Lee, Korea Maritime and Ocean
University, South Korea
Paper Title: Innovative Design Method of Incremental Profile Ring Rolling Process for Manufacturing Seamless Ring with Arbitrarily Shaped Profiles
3. Hiroki Kurita, Tohoku University, Japan
Paper Title: Fracture toughness evaluation of TiB reinforced TiB composites fabricated by spark plasma sintering
The conference is open to public (one needs to register first). In general, there are 4 types of participants to this conference, which are given as follows:
Making a presentation at the conference and publishing the paper.
*Submit your Full Paper (no less than 6 pages) first to start with; Click to submit your paper via Online Submission System.
Making a presentation only at the conference without paper publication.
*Submit your paper abstract (200-400 words) first to start with; Click to submit your abstract via Online Submission System.
Participating in the conference only without presentation or paper publication.
*Download the registration form for listeners and send the filled form to the conference secretariat at email@example.com for successful registration confirmation.
4. Sponsors / Partners
If you are interested in sponsoring or cooperating with ICDMM 2019, please contact us at firstname.lastname@example.org.
Accepted papers of ICDMM 2019 will be published into conference proceedings, which will be submitted for index by Ei Compendex and Scopus.
|ICDMM 2018||Materials Science Forum||ISSN:1662-9752||TBA|
|ICDMM 2017||IOP Conference Series: Materials Science and Engineering||ISSN: 1757-8981||Vol. 220|
|ICDMM 2016||Key Engineering Materials||ISBN: 978-3-03835-731-5||Vol. 706|